electronics

Detailed Product Description

1.     Layer: 1-30

2.     Board finished thickness:0.21mm-7.0mm

3.     Material: FR-4,CEM-1,CEM-3, High TG, FR4Halogen Free, Rogers

4.     Max. finished board size: 23-25(580mm*900mm)

5.     Min. ldrilled hole size: 3mil(0.075mm)

6.     Min. line width: 3mil(0.075mm)

Min. Line spacing: 3mil(0.075mm)

7.     Surface finish/treatment: HASL/HASL lead free, HAL,

8.     Copper thickness in hole: >25.0um.(>1mil)

9.     Inner Packing: Vacuum packing/Plastic bad

Outer packing: Standard carton packing

10. Shape tolerance: ±0.13

Hole tolerance: PTH: ±0.076,NPTH: ±0.05

11. Certificate: UL, ISO9001, ISO14001,SGS,RoHS

12. Special requirements: Buried and blind vias +controlled Impedance + BGA

13. Profiling: Punching, Routing, V-CUT, Beveling

14. Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products